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        1. STOCK CODE

          R & D CAPABILITIES

          Topband has set up flexible production lines running for multiple customers and products.

          We adapt Lean manufacturing, and our production management is applied with advanced SAP and MES process management systems, which will enable management of orders, materials, equipments and manufacturing process information visualization, real-time and integration. Currently, we have almost one hundred production lines consist of three types, which are DIP lines, SMT lines and AI lines , and All our manufacturing processes meet RoHS and REACH standards.

          Production Process Capability
          Quality Control Capability
          • Processing capability of SMT equipment for single and mulitilayer PCBA
          • Full implementation of lead-free and ROSH prodution process
          • SMT equipment can be mounting with 0.3mm spacing components and 256 balls BAG and minimum 0201 compoments
          • On line and off line programming for products
          • To plan and design Automatic assembly line for finish goods
          • To control the conformal coating thickness above 200um
          • Automatic potting glue for PCBA waterproof
          • To develop automatic test euqiupment and test fixture
          • Ultrasonic and pulse welding for FPC products
          • With AOI and 2D X-ray analy sis equipment
          • Laser marking and caving ability
          • Process control ability (SPC,PFMEA/DFMEA ,QCP,APQP,PPAQ and PDCA)
          • With products tracebility system(MES)
          • Implement lean manufacturing system( kanban, change-over,SMD)
          • ESD management system(apply ESD 20.20)
          • 6S (5S + Safety)
          • IPC(Certified IPC-A-610D,IPC-7711/7721)
          • MSA & CpkCmk Study

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